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IEEE Transactions on Circuits and Systems I |
| TCAS-I EDITORIAL BOARD 2012-2013 |
EDITOR-IN-CHIEF
Gabriele Manganaro
Analog Devices
804 Woburn St., M/S 623
Wilmington, MA 01887-3494 U.S.A.
E-mail: eic.tcas1(at)gmail.com
DEPUTY EDITOR-IN-CHIEF
Shanthi Pavan
Indian Institute of Technology, Madras
Chennai 600036
India
E-mail: shanthi(at)ee.iitm.ac.in
EDITORIAL ASSISTANT
Anna Laura Simoni
21 View Terrace
Aberdeen
Scotland
E-mail: tcas1(at)tcad.polito.it
ASSOCIATE EDITORS
Aleksandar Tasic
Qualcomm Inc., San Diego
USA
E-mail: atasic(at)qti.qualcomm.com
Andreas Demosthenous
University College, London
United Kingdom
E-mail: a.demosthenous(at)ee.ucl.ac.uk
Antonio Strollo
University of Napoli
Italy
E-mail: astrollo(at)unina.it
Chua-Chin Wang
National Sun Yat-Sen University
Taiwan
E-mail: ccwang(at)ee.nsysu.edu.tw
Deming Chen
University of Illinois, Urbana
USA
E-mail: dchen(at)illinois.edu
Bah-Hwee Gwee
Nanyang Technological University
Singapore
E-mail: ebhgwee(at)ntu.edu.sg
Chip Hong Chang
Nanyang Technological University
Singapore
E-mail: echchang(at)ntu.edu.sg
Howard Luong
Hong Kong University of Science and Technology
Hong Kong
E-mail: eeluong(at)ee.ust.hk
Henry S. Chung
City University of Hong Kong
Hong Kong
E-mail: eeshc(at)cityu.edu.hk
Felix Lustenberger
ElementCheck AG
Hinterbergstrasse 15
CH-6330 Cham, Switzerland
E-mail: felix.lustenberger(at)ieee.org
Frank O'Mahony
Intel
USA
E-mail: frank.omahony(at)intel.com
Gao Huijun
Harbin Institute of Technology
China
E-mail: hjgao(at)hit.edu.cn
Igor Belykh
Georgia State University, Atlanta, GA
USA
E-mail: ibelykh(at)gsu.edu
Jaeha Kim
Seoul National University
South Korea
E-mail: jaeha(at)ieee.org
Jipeng Li
Analog Devices
USA
E-mail: jipeng.li(at)analog.com
Jan Mulder
Broadcom
The Netherlands
E-mail: jmulder(at)broadcom.com
Jose Barreiro da Silva
Mediatek
USA
E-mail: jose-b.silva(at)mediatek.com
Xiang Li
Fudan University, Shanghai
China
E-mail: lix(at)fudan.edu.cn
Jun Ma
Shanghai Jiaotong University
China
E-mail: majun(at)sjtu.edu.cn
Massimo Alioto
University of Siena
Italy
E-mail: malioto(at)dii.unisi.it
Mohab Anis
The American University in Cairo
Cairo, Egypt
E-mail: manis(at)vlsi.uwaterloo.ca
Marina Mondin
Politecnico di Torino
Turin, Italy
E-mail: marina.mondin(at)polito.it
Mihai Sanduleanu
Philips Research Eindhoven
The Netherlands
E-mail: mihai.sanduleanu(at)philips.com
Yehia Massoud
The University of Alabama, Birmingham
USA
E-mail: massoud(at)uab.edu
Mattia Frasca
University of Catania,
Catania, Italy
E-mail: mfrasca(at)diees.unict.it
Massimiliano Laddomada
Texas A&M University, Texarkana
TX, USA
E-mail: mladdomada(at)tamut.edu
Mrityun Chakraborty
Indian Institute of Technology (IIT), Kharagpur
India
E-mail: mrityun(at)ece.iitkgp.ernet.in
Muhammad M. Khellah
Intel
USA
E-mail: mkhellah(at)gmail.com
Nathan M. Neihart
Iowa State University, Ames IA
USA
E-mail: neihart(at)iastate.edu
Andrea Neviani
University of Padova
Italy
E-mail: neviani(at)dei.unipd.it
Norikazu Takahashi
Kyushu University
Fukuoka
Japan
E-mail: norikazu(at)csce.kyushu-u.ac.jp
Pramod Kumar Meher
Institute for Infocomm Research
Singapore
E-mail: pkmeher(at)gmail.com
Ricardo Carmona Galán
Universidad de Sevilla
Spain
E-mail: rcarmona(at)imse-cnm.csic.es
Reza Lotfi
Ferdowsi University of Mashhad
Iran
E-mail: rlotfi(at)ieee.org
Sameer Sonkusale
Tufts University
USA
E-mail: sameer(at)ece.tufts.edu
Ming-Der Shieh
National Cheng Kung University, Tainan
Taiwan
E-mail: shiehm(at)mail.ncku.edu.tw
Srikanth Gondi
Silicon Image
USA
E-mail: sgondi(at)gmail.com
Chien-Cheng Tseng
National Kaohsiung First University of Science and Technology
Taiwan
E-mail: tcc(at)nkfust.edu.tw
Teresa Serrano Gotarredona
Instituto de Microelectronica de Sevilla
Spain
E-mail: terese(at)imse.cnm.es
Peter T.J. Liang
National Cheng Kung University, Tainan
Taiwan
E-mail: tjliang(at)mail.ncku.edu.tw
Vincent Gaudet
University of Waterloo
Canada
E-mail: vcgaudet(at)ecemail.uwaterloo.ca
Xinghuo Yu
RMIT University
Melbourne, Australia
E-mail: x.yu(at)rmit.edu.au
Xinmiao Zhang
Case Western Reserve University, Ohio
USA
E-mail: xxz36(at)case.edu
Yichuang Sun
University of Hertfordshire
United Kingdom
E-mail: y.sun(at)herts.ac.uk
Sherif Embabi
Nvidia
USA
E-mail: sembabi(at)nvidia.com
Filippo Neri
Samsung
South Korea
E-mail: filippo.neri(at)bluewin.ch
Souvik Chattopadhyay
Indian Institute of Technology Kharagpur
India
E-mail: souvik(at)ee.iitkgp.ernet.in
Jose M. De La Rosa
Instituto de Microelectronica de Sevilla
Spain
E-mail: jrosa(at)imse-cnm.csic.es
Naehyuck Chang
Seoul National University
Korea
E-mail: naehyuck(at)elpl.snu.ac.kr
Charles J. Alpert
IBM Austin Research Laboratory
USA
E-mail: alpert(at)us.ibm.com
Rifat Sipahi
Northeastern University, Boston
USA
E-mail: rifat(at)coe.neu.edu
Tokunbo Ogunfunmi
Santa Clara University, Santa Clara
USA
E-mail: togunfunmi(at)scu.edu
Hsie-Chia Chang
National Chiao Tung University, Hsinchu
Taiwan
E-mail: hcchang(at)mail.nctu.edu.tw
Andreas Burg
Ecole Polytechnique Federale de Lausanne, Lausanne
Switzerland
E-mail: andreas.burg(at)epfl.ch
Roberto Gomez-Garcia
University of Alcalá, Madrid
Spain
E-mail: roberto.gomezg(at)uah.es
Bharadwaj Amrutur
Indian Institute of Science, Bangalore
India
E-mail: amrutur(at)ece.iisc.ernet.in
Shao-Yi Chien
National Taiwan University, Taipei
Taiwan
E-mail: sychien(at)cc.ee.ntu.edu.tw
Yoko Uwate
Tokushima University
Japan
E-mail: uwate(at)ee.tokushima-u.ac.jp
Andrea Mazzanti
University of Pavia
Italy
E-mail: andrea.mazzanti(at)unipv.it
Ashkan Ashrafi
San Diego State University
USA
E-mail: ashrafi(at)mail.sdsu.edu
Ching-Te Chiu
National Tsing Hua University
Taiwan
E-mail: ctchiu(at)cs.nthu.edu.tw
Fabien Clermidy
Laboratoire d'electronique et de technologie de l'information
France
E-mail: fabien.clermidy(at)cea.fr
Federico Bizzarri
Politecnico di Milano
Italy
E-mail: bizzarri(at)elet.polimi.it
Kostas Doris
NXP Semiconductors
The Netherlands
E-mail: kostas.doris(at)nxp.com
Peng Shi
University of Adelaide
Australia
E-mail: peng.shi(at)vu.edu.au
Patrick Reynaert
K.U. Leuven
Belgium
E-mail: patrick.reynaert(at)esat.kuleuven.be
Zhengya Zhang
University of Michigan
USA
E-mail: zhengya(at)umich.edu
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