EDITOR-IN-CHIEF

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Gabriele Manganaro

Analog Devices

804 Woburn St., M/S 623

Wilmington, MA 01887-3494 U.S.A.

E-mail: eic.tcas1(at)gmail.com

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DEPUTY EDITOR-IN-CHIEF

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Shanthi Pavan

Indian Institute of Technology, Madras

Chennai 600036

India

E-mail: shanthi(at)ee.iitm.ac.in

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EDITORIAL ASSISTANT

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Anna Laura Simoni

21 View Terrace

Aberdeen

Scotland

E-mail: tcas1(at)tcad.polito.it

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ASSOCIATE EDITORS

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Bah-Hwee Gwee

Nanyang Technological University

Singapore

E-mail: ebhgwee(at)ntu.edu.sg

Henry S. Chung

City University of Hong Kong

Hong Kong

E-mail: eeshc(at)cityu.edu.hk

Frank O'Mahony

Intel

USA

E-mail: frank.omahony(at)intel.com

Igor Belykh

Georgia State University, Atlanta, GA

USA

E-mail: ibelykh(at)gsu.edu

Jaeha Kim

Seoul National University

South Korea

E-mail: jaeha(at)ieee.org

Jan Mulder

Broadcom

The Netherlands

E-mail: jmulder(at)broadcom.com

Jose Barreiro da Silva

Analog Devices

USA

E-mail: jose-b.silva(at)analog.com

Jun Ma

Shanghai Jiaotong University

China

E-mail: majun(at)sjtu.edu.cn

Massimo Alioto

University of Siena

Italy

E-mail: malioto(at)dii.unisi.it

Mattia Frasca

University of Catania,

Catania, Italy

E-mail: mfrasca(at)diees.unict.it

Muhammad M. Khellah

Intel

USA

E-mail: mkhellah(at)gmail.com

Nathan M. Neihart

Iowa State University, Ames IA

USA

E-mail: neihart(at)iastate.edu

Pramod Kumar Meher

Institute for Infocomm Research

Singapore

E-mail: pkmeher(at)gmail.com

Ricardo Carmona Galán

Universidad de Sevilla

Spain

E-mail: rcarmona(at)imse-cnm.csic.es

Srikanth Gondi

Silicon Image

USA

E-mail: sgondi(at)gmail.com

Teresa Serrano Gotarredona

Instituto de Microelectronica de Sevilla

Spain

E-mail: terese(at)imse.cnm.es

Filippo Neri

Samsung

South Korea

E-mail: filippo.neri(at)bluewin.ch

Souvik Chattopadhyay

Indian Institute of Technology Kharagpur

India

E-mail: souvik(at)ee.iitkgp.ernet.in

Jose M. De La Rosa

Instituto de Microelectronica de Sevilla

Spain

E-mail: jrosa(at)imse-cnm.csic.es

Naehyuck Chang

Seoul National University

Korea

E-mail: naehyuck(at)elpl.snu.ac.kr

Charles J. Alpert

IBM Austin Research Laboratory

USA

E-mail: alpert(at)us.ibm.com

Rifat Sipahi

Northeastern University, Boston

USA

E-mail: rifat(at)coe.neu.edu

Tokunbo Ogunfunmi

Santa Clara University, Santa Clara

USA

E-mail: togunfunmi(at)scu.edu

Hsie-Chia Chang

National Chiao Tung University, Hsinchu

Taiwan

E-mail: hcchang(at)mail.nctu.edu.tw

Andreas Burg

Ecole Polytechnique Federale de Lausanne, Lausanne

Switzerland

E-mail: andreas.burg(at)epfl.ch

Roberto Gomez-Garcia

University of Alcalá, Madrid

Spain

E-mail: roberto.gomezg(at)uah.es

Bharadwaj Amrutur

Indian Institute of Science, Bangalore

India

E-mail: amrutur(at)ece.iisc.ernet.in

Shao-Yi Chien

National Taiwan University, Taipei

Taiwan

E-mail: sychien(at)cc.ee.ntu.edu.tw

Yoko Uwate

Tokushima University

Japan

E-mail: uwate(at)ee.tokushima-u.ac.jp

Andrea Mazzanti

University of Pavia

Italy

E-mail: andrea.mazzanti(at)unipv.it

Ashkan Ashrafi

San Diego State University

USA

E-mail: ashrafi(at)mail.sdsu.edu

Ching-Te Chiu

National Tsing Hua University

Taiwan

E-mail: ctchiu(at)cs.nthu.edu.tw

Fabien Clermidy

Laboratoire d'electronique et de technologie de l'information

France

E-mail: fabien.clermidy(at)cea.fr

Federico Bizzarri

Politecnico di Milano

Italy

E-mail: bizzarri(at)elet.polimi.it

Kostas Doris

NXP Semiconductors

The Netherlands

E-mail: kostas.doris(at)nxp.com

Peng Shi

University of Adelaide

Australia

E-mail: peng.shi(at)vu.edu.au

Patrick Reynaert

K.U. Leuven

Belgium

E-mail: patrick.reynaert(at)esat.kuleuven.be

Zhengya Zhang

University of Michigan

USA

E-mail: zhengya(at)umich.edu

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